17854130. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jihoon Chang of Yongin-si (KR)

Dong-Wan Kim of Hwaseong-si (KR)

Dong-Sik Park of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17854130 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a semiconductor device that includes a substrate with an active cell region and an interfacial region. Bit lines are placed on the active cell region, while bit-line pads are placed on the interfacial region.

  • The bit lines are spaced apart from each other in a direction that intersects the active cell region.
  • Each bit line consists of a first and second bit line that extend in a different direction and are spaced apart from each other.
  • A connection part connects the first end of the first bit line to the second end of the second bit line.
  • A coupling part connects one of the bit-line pads to either the first bit line, second bit line, or the connection part.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Electronics industry
  • Integrated circuit design

Problems solved by this technology:

  • Efficiently connecting bit lines in a semiconductor device
  • Reducing space requirements for bit lines
  • Improving overall performance and functionality of the device

Benefits of this technology:

  • Increased efficiency in data transfer and processing
  • Enhanced performance and reliability of semiconductor devices
  • Cost-effective manufacturing process with reduced space requirements


Original Abstract Submitted

A semiconductor device includes a substrate having an active cell region and an interfacial region adjacent to each other in a first direction, bit lines on the active cell region of the substrate that are spaced apart from each other in a second direction that intersects the first direction, and bit-line pads on the interfacial region of the substrate that are spaced apart from each other in the second direction. Each of the bit lines includes a first bit line and a second bit line that extend in the first direction and are spaced apart from each other in the second direction, a connection part that connects a first end of the first bit line to a second end of the second bit line, and a coupling part that connects one of the bit-line pads to one of the first bit line, the second bit line, and the connection part.