17852614. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17852614 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The abstract describes a semiconductor package and its fabrication methods. The package includes a redistribution substrate with an organic dielectric layer and a metal pattern, as well as a semiconductor chip on the substrate. The organic dielectric layer has specific optical properties, including absorbance and fluorescence intensity, within a certain wavelength range.
- The semiconductor package includes a redistribution substrate with an organic dielectric layer and a metal pattern.
- A semiconductor chip is placed on the redistribution substrate.
- The organic dielectric layer has specific optical properties, including absorbance and fluorescence intensity.
- The absorbance of the organic dielectric layer is equal to or greater than 0.04 within a wavelength range of 450 nm to 650 nm.
- The fluorescence intensity of the organic dielectric layer is equal to or greater than 4×10 within the same wavelength range.
Potential Applications
- Semiconductor packaging industry
- Electronics manufacturing
Problems Solved
- Improved optical properties of the organic dielectric layer
- Enhanced performance and functionality of the semiconductor package
Benefits
- Higher absorbance and fluorescence intensity within the specified wavelength range
- Improved efficiency and reliability of the semiconductor package
- Potential for better performance in various applications
Original Abstract Submitted
Disclosed are semiconductor packages and their fabrication methods. The semiconductor package includes a redistribution substrate that includes an organic dielectric layer and a metal pattern in the organic dielectric layer, and a semiconductor chip on the redistribution substrate. The organic dielectric layer has a maximum absorbance equal to or greater than about 0.04 at a first wavelength range, and a fluorescence intensity equal to or greater than about 4×10at the first wavelength range. The first wavelength range is about 450 nm to about 650 nm.
