17851333. SYSTEMS AND METHODS FOR CRYOGENIC COOLING simplified abstract (Microsoft Technology Licensing, LLC)

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SYSTEMS AND METHODS FOR CRYOGENIC COOLING

Organization Name

Microsoft Technology Licensing, LLC

Inventor(s)

Luke Thomas Gregory of Mercer Island WA (US)

Rick Chun Kit Cheung of Lynnwood WA (US)

SYSTEMS AND METHODS FOR CRYOGENIC COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17851333 titled 'SYSTEMS AND METHODS FOR CRYOGENIC COOLING

Simplified Explanation

Abstract: A computing system is described that includes a heat-generating component and an evaporation plate thermally connected to the heat-generating component. The system also includes a cryogenic cooling system positioned near the evaporation plate, which releases a cryogenic fluid onto the plate to cool the heat-generating component. The cryogenic fluid has a boiling point below 273 K.

Patent/Innovation Explanation:

  • Computing system with a heat-generating component and an evaporation plate connected to it.
  • Cryogenic cooling system positioned near the evaporation plate.
  • Cryogenic cooling system releases a cryogenic fluid onto the plate to cool the heat-generating component.
  • Cryogenic fluid used has a boiling point below 273 K.

Potential Applications:

  • High-performance computing systems.
  • Data centers and server farms.
  • Overclocked gaming computers.
  • Supercomputers and scientific simulations.
  • Any application requiring efficient cooling of heat-generating components.

Problems Solved:

  • Overheating of heat-generating components in computing systems.
  • Inadequate cooling solutions for high-performance computing.
  • Thermal management challenges in data centers and server farms.
  • Limitations of traditional cooling methods for overclocked gaming computers.
  • Ensuring optimal performance and longevity of heat-generating components.

Benefits:

  • Efficient cooling of heat-generating components.
  • Improved performance and reliability of computing systems.
  • Reduced risk of component damage due to overheating.
  • Enhanced thermal management capabilities for high-performance computing.
  • Potential for increased lifespan and reduced maintenance costs.


Original Abstract Submitted

A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing system includes a cryogenic cooling system positioned proximate to the evaporation plate. The cryogenic cooling system is configured to release a cryogenic fluid onto the evaporation plate to cool the heat-generating component. The cryogenic fluid has a boiling point of less than 273 K.

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