17849345. INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CIRCUIT BLOCKS IN INTEGRATED CIRCUIT simplified abstract (Samsung Electronics Co., Ltd.)
INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CIRCUIT BLOCKS IN INTEGRATED CIRCUIT
Organization Name
Inventor(s)
Eun Sung Kim of Clifton Park NY (US)
Kang-ill Seo of Albany NY (US)
INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CIRCUIT BLOCKS IN INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 17849345 titled 'INTERCONNECT STRUCTURE HAVING DIFFERENT DIMENSIONS FOR CONNECTED CIRCUIT BLOCKS IN INTEGRATED CIRCUIT
Simplified Explanation
Abstract: An interconnect structure for an integrated circuit includes a metal line with sections of varying thicknesses along a specific direction, and multiple vias protruding from these sections.
- The interconnect structure is designed for use in an integrated circuit.
- The metal line consists of multiple sections with different thicknesses.
- The varying thicknesses of the sections are arranged in a specific direction.
- The structure includes multiple vias that extend from the different sections of the metal line.
- The vias provide connections between different layers or components of the integrated circuit.
- The interconnect structure improves the efficiency and performance of the integrated circuit by optimizing the flow of electrical signals.
- The design allows for more efficient routing of signals within the integrated circuit.
- The varying thicknesses of the metal line sections enable better control of signal propagation and reduce signal interference.
- The structure enhances the overall reliability and functionality of the integrated circuit.
Potential Applications:
- Semiconductor industry
- Integrated circuit manufacturing
- Electronics manufacturing
Problems Solved:
- Signal interference and degradation in integrated circuits
- Inefficient routing of electrical signals
- Limited control over signal propagation
Benefits:
- Improved efficiency and performance of integrated circuits
- Enhanced signal propagation control
- Reduced signal interference and degradation
- Increased reliability and functionality of integrated circuits
Original Abstract Submitted
A interconnect structure for an integrated circuit may include: a metal line including a plurality of sections having different thicknesses along a 1direction; and a plurality of vias respectively protruding from the plurality of sections of the metal line.
