17848755. ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING simplified abstract (Microsoft Technology Licensing, LLC)

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ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING

Organization Name

Microsoft Technology Licensing, LLC

Inventor(s)

Bharath Ramakrishnan of Bellevue WA (US)

Husam Atallah Alissa of Redmond WA (US)

Christian L. Belady of Mercer Island WA (US)

Sean Michael James of Olympia WA (US)

Vaidehi Oruganti of Kirkland WA (US)

ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17848755 titled 'ULTRA DENSE PROCESSORS WITH EMBEDDED MICROFLUIDIC COOLING

Simplified Explanation

The abstract describes a processing unit that consists of two dies separated by a microfluidic volume. The dies are connected by at least one heat transfer structure located within the microfluidic volume. An electrochemical fluid is present in the microfluidic volume to provide electrochemical energy to the dies and absorb heat from them.

  • The processing unit includes two dies and a microfluidic volume.
  • The dies are connected by a heat transfer structure within the microfluidic volume.
  • An electrochemical fluid is used to provide energy to the dies and absorb heat from them.

Potential Applications:

  • This technology can be used in electronic devices such as computers, smartphones, and servers to improve their processing capabilities and thermal management.
  • It can also be applied in high-performance computing systems, data centers, and other computing-intensive environments.

Problems Solved:

  • The technology addresses the challenge of thermal management in electronic devices by providing an efficient heat transfer mechanism.
  • It solves the problem of limited processing capabilities by utilizing electrochemical energy to enhance the performance of the dies.

Benefits:

  • The use of a microfluidic volume and heat transfer structure improves the cooling efficiency of the processing unit, preventing overheating and potential damage to the dies.
  • The integration of electrochemical energy enhances the processing capabilities of the dies, leading to improved performance and efficiency.
  • This technology offers a compact and scalable solution for thermal management and energy supply in electronic devices.


Original Abstract Submitted

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

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