17848061. MEMORY OPERATION BASED ON BLOCK-ASSOCIATED TEMPERATURE simplified abstract (MICRON TECHNOLOGY, INC.)
Contents
MEMORY OPERATION BASED ON BLOCK-ASSOCIATED TEMPERATURE
Organization Name
Inventor(s)
Pitamber Shukla of Boise ID (US)
Ching-Huang Lu of Fremont CA (US)
Devin Batutis of San Jose CA (US)
MEMORY OPERATION BASED ON BLOCK-ASSOCIATED TEMPERATURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17848061 titled 'MEMORY OPERATION BASED ON BLOCK-ASSOCIATED TEMPERATURE
Simplified Explanation
The patent application describes techniques for performing memory operations based on the temperature of a memory block in a memory device. Here are the key points:
- The techniques involve performing memory block compaction, block folding, or refresh operations based on the temperature of the memory block.
- In some embodiments, a block compaction operation is performed on a memory block when its temperature is equal to or higher than a predetermined temperature value.
- Other embodiments involve performing a block folding/refresh operation on one or more blocks that have data written at a temperature lower than the predetermined temperature value, but the operation is performed at or above the predetermined temperature value.
Potential applications of this technology:
- Memory devices in various electronic devices such as computers, smartphones, tablets, etc.
- Data centers and servers that rely on memory devices for storage and processing.
Problems solved by this technology:
- Memory blocks can experience different temperatures during operation, which can affect their performance and reliability.
- By performing memory operations based on temperature, the techniques ensure that the operations are carried out at appropriate temperature levels, optimizing performance and reducing potential issues.
Benefits of this technology:
- Improved performance and reliability of memory devices by considering temperature in memory operations.
- Efficient utilization of memory blocks by performing operations at optimal temperature levels.
- Enhanced lifespan of memory devices by avoiding operations at extreme temperature conditions.
Original Abstract Submitted
Various embodiments provide for performing a memory operation, such as a memory block compaction operation or block folding or refresh operation, based on a temperature associated with a memory block of a memory device. For instance, some embodiments provide for techniques that can cause performance of a block compaction operation on a memory block at a temperature that is at least at or higher than a predetermined temperature value. Additionally, some embodiments provide for techniques that can cause performance of a block folding/refresh operation, at a temperature that is at or higher than the predetermined temperature value, on one or more blocks on which data was written at a temperature lower than the predetermined temperature value.
