17841031. PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sukkoo Hong of Suwon-si (KR)

Moohyun Koh of Hwaseong-si (KR)

Kyungoh Kim of Yongin-si (KR)

Yechan Kim of Hwaseong-si (KR)

Kyunghwan Noh of Seoul (KR)

Sungan Do of Hwaseong-si (KR)

Hyun-Ji Song of Suwon-si (KR)

PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17841031 titled 'PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME

Simplified Explanation

The abstract describes a photoresist composition for use in lithography processes. The composition includes an organometallic compound, a photoinitiator, and a solvent.

  • The organometallic compound contains a metal core and organic ligands bonded to the metal core.
  • The metal-ligand bond in the organometallic compound is not breakable by exposure to light or moisture.
  • The photoinitiator generates an acid or a radical when exposed to light.
  • The solvent is used to dissolve and disperse the organometallic compound and photoinitiator.

Potential applications of this technology:

  • Lithography processes in semiconductor manufacturing.
  • Fabrication of microelectromechanical systems (MEMS).
  • Production of high-resolution printed circuit boards (PCBs).

Problems solved by this technology:

  • Improved resistance to light and moisture, leading to better performance and durability of the photoresist composition.
  • Enhanced control over the initiation of chemical reactions during lithography processes.

Benefits of this technology:

  • Increased efficiency and accuracy in lithography processes.
  • Extended lifespan and reliability of electronic devices.
  • Cost savings through reduced material waste and improved process yield.


Original Abstract Submitted

A photoresist composition includes an organometallic compound including at least one metal-ligand bond, the organometallic compound including a metal core and at least one organic ligand bonded to the metal core, and being configured such that the at least one metal-ligand bond is not breakable by exposure to light or moisture; a photoinitiator generating an acid or a radical in response to exposure to light; and a solvent.

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