17840338. Pressure Based Phase Immersion Cooling System simplified abstract (Microsoft Technology Licensing, LLC)

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Pressure Based Phase Immersion Cooling System

Organization Name

Microsoft Technology Licensing, LLC

Inventor(s)

Vaidehi Oruganti of Kirkland WA (US)

Christian L. Belady of Mercer Island WA (US)

Husam Alissa of Redmond WA (US)

Bharath Ramakrishnan of Bellevue WA (US)

Ruslan Nagimov of Redmond WA (US)

Pressure Based Phase Immersion Cooling System - A simplified explanation of the abstract

This abstract first appeared for US patent application 17840338 titled 'Pressure Based Phase Immersion Cooling System

Simplified Explanation

The patent application describes techniques for dynamically changing the pressure within a pressurized cooling system to allow for different cooling rates in cooling electronic equipment. The system uses a two-phase immersion cooling container filled with dielectric heat transfer fluid to cool heat generating components.

  • The pressurized cooling system can maintain different pressure levels.
  • A pressure system is used to modify the pressure within the container.
  • The system operates in a first state when the pressure is above a threshold level.
  • The system operates in a second state when the pressure is at the threshold level.
  • The operating state of the heat generating component determines whether the system operates in the first or second state.

Potential Applications

  • Cooling electronic equipment, such as servers, data centers, or high-performance computing systems.
  • Cooling heat generating components in electric vehicles or aerospace systems.

Problems Solved

  • Provides a way to dynamically change the cooling rate based on the operating state of the heat generating component.
  • Allows for more efficient cooling of electronic equipment by adjusting the pressure within the cooling system.

Benefits

  • Improved cooling efficiency and performance of electronic equipment.
  • Ability to adapt the cooling rate to the specific needs of different heat generating components.
  • Potential for energy savings by optimizing the cooling process.


Original Abstract Submitted

Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.