17840322. SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS simplified abstract (Western Digital Technologies, Inc.)

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

Organization Name

Western Digital Technologies, Inc.

Inventor(s)

Shenghua Huang of Shanghai (CN)

Binbin Zheng of Shanghai (CN)

Shaopeng Dong of Shanghai (CN)

Songtao Lu of Shanghai (CN)

Rui Guo of Shanghai (CN)

Yangming Liu of Shanghai (CN)

Bo Yang of Milpitas CA (US)

Ning Ye of San Jose CA (US)

SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17840322 titled 'SEMICONDUCTOR DEVICE INCLUDING REINFORCING BLOCKS

Simplified Explanation

Abstract: A semiconductor device includes a substrate, semiconductor dies on the substrate, molding compound and reinforcing blocks on the substrate. The reinforcing blocks may be provided at positions on the substrate where mechanical stresses develop in the device during singulation, such as at curves and/or discontinuous points around the outline of the substrate, to add strength to the substrate.

Patent/Innovation Explanation:

• The semiconductor device consists of a substrate, semiconductor dies, molding compound, and reinforcing blocks.
• Reinforcing blocks are strategically placed on the substrate to strengthen it at positions where mechanical stresses occur during singulation.
• These positions include curves and discontinuous points around the outline of the substrate.
• The purpose of the reinforcing blocks is to enhance the overall strength of the substrate, preventing potential damage or failure.

Potential Applications:

• Semiconductor manufacturing industry
• Electronics industry
• Integrated circuit production

Problems Solved:

• Mechanical stresses during singulation can weaken the substrate of a semiconductor device.
• Curves and discontinuous points are particularly vulnerable to damage.
• The invention addresses these issues by adding reinforcing blocks to strengthen the substrate at these critical positions.

Benefits of this Technology:

• Improved durability and reliability of semiconductor devices.
• Reduced risk of substrate damage or failure during singulation.
• Enhanced overall performance and lifespan of the devices.

Original Abstract Submitted

A semiconductor device includes a substrate, semiconductor dies on the substrate, molding compound and reinforcing blocks on the substrate. The reinforcing blocks may be provided at positions on the substrate where mechanical stresses develop in the device during singulation, such as at curves and/or discontinuous points around the outline of the substrate, to add strength to the substrate.