17837379. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Ju-Il Choi of Seongnam-si (KR)
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17837379 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The patent application describes a semiconductor device consisting of a substrate and two packages. The first package includes a lower redistribution layer, a core semiconductor stack with a core chip and a through via, and a memory semiconductor stack with memory chips. The second package also includes a lower redistribution layer, a core semiconductor stack with a core chip, and a memory semiconductor stack with memory chips. The first through via connects the first and second lower redistribution layers.
- The semiconductor device includes a substrate and two packages.
- The first package has a lower redistribution layer, a core semiconductor stack, and a memory semiconductor stack.
- The second package also has a lower redistribution layer, a core semiconductor stack, and a memory semiconductor stack.
- The first through via connects the first and second lower redistribution layers.
Potential Applications
- This technology can be used in various electronic devices such as smartphones, tablets, and computers.
- It can be applied in the automotive industry for advanced driver assistance systems and infotainment systems.
- The semiconductor device can be used in medical devices, industrial automation, and Internet of Things (IoT) applications.
Problems Solved
- The patent addresses the need for a compact and efficient semiconductor device with multiple packages.
- It solves the problem of connecting the lower redistribution layers of the two packages.
- The through via allows for improved electrical connectivity between the packages.
Benefits
- The semiconductor device provides increased functionality and performance with multiple packages.
- It allows for more efficient use of space on the substrate.
- The through via enables better communication and data transfer between the packages.
Original Abstract Submitted
A semiconductor device including a substrate and first and second packages thereon, the first package includes a first lower redistribution layer; a first core semiconductor stack thereon and including a first core chip and a first through via stacked on the first lower redistribution layer; and a first memory semiconductor stack on the first lower redistribution layer and including first memory chips stacked on the first lower redistribution layer, the second package includes a second lower redistribution layer; a second core semiconductor stack thereon and including a second core chip on the second lower redistribution layer; and a second memory semiconductor stack on the second lower redistribution layer and including second memory chips stacked on the second lower redistribution layer, the first through via penetrates the first core semiconductor stack, and the first and second lower redistribution layers are electrically connected to each other through the first through via.
