17837260. SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17837260 titled 'SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate, a spacer chip with a groove pattern, at least one semiconductor chip mounted on the package substrate, and a sealing member covering the chips.
- The package substrate serves as a base for the semiconductor package.
- The spacer chip is attached to the package substrate and has a groove pattern on its surface.
- The semiconductor chip(s) are mounted on the spacer chip using an adhesive film.
- A sealing member is applied on the package substrate, covering both the spacer chip and the semiconductor chip(s).
Potential Applications
- Electronics industry
- Semiconductor manufacturing
Problems Solved
- Provides a structure for mounting semiconductor chips on a package substrate.
- Ensures proper alignment and spacing between the chips.
- Protects the chips from external elements.
Benefits
- Improved packaging efficiency and reliability.
- Enhanced protection for the semiconductor chips.
- Simplified manufacturing process.
Original Abstract Submitted
A semiconductor package including: a package substrate; a spacer chip attached on a surface of the package substrate, the spacer chip having a groove pattern in a surface of the spacer chip; at least one semiconductor chip mounted on the package substrate, the at least one semiconductor chip being attached on the surface of the spacer chip via an adhesive film; and a sealing member on the surface of the package substrate, the sealing member covering the spacer chip and the at least one semiconductor chip.
