17835861. PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK SIDE POWER DISTRIBUTION NETWORK simplified abstract (QUALCOMM Incorporated)
Contents
- 1 PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK SIDE POWER DISTRIBUTION NETWORK
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK SIDE POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK SIDE POWER DISTRIBUTION NETWORK
Organization Name
Inventor(s)
Biancun Xie of San Diego CA (US)
Shree Krishna Pandey of San Diego CA (US)
PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK SIDE POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract
This abstract first appeared for US patent application 17835861 titled 'PACKAGE COMPRISING A SUBSTRATE WITH A BRIDGE CONFIGURED FOR A BACK SIDE POWER DISTRIBUTION NETWORK
Simplified Explanation
The abstract describes a package that includes a substrate, a bridge, and two integrated devices. The bridge is made up of a bridge substrate, dielectric layers, and interconnects. The interconnects extend through the dielectric layers and the bridge substrate.
- The package includes a substrate, bridge, and two integrated devices.
- The bridge is made up of a bridge substrate, dielectric layers, and interconnects.
- The interconnects extend through the dielectric layers and the bridge substrate.
Potential Applications
- This technology can be used in electronic devices such as smartphones, tablets, and computers.
- It can also be applied in the automotive industry for vehicle electronics.
- The package can be used in medical devices, aerospace systems, and industrial equipment.
Problems Solved
- The package provides a compact and efficient way to integrate multiple devices on a single substrate.
- It allows for improved signal transmission and reduced power consumption.
- The bridge design enables better thermal management and reliability.
Benefits
- The package offers increased functionality and performance in electronic devices.
- It allows for miniaturization and cost reduction in device manufacturing.
- The bridge design improves the overall reliability and lifespan of the integrated devices.
Original Abstract Submitted
A package comprising a substrate, a bridge located in the substrate, a first integrated device coupled to the substrate and a second integrated device coupled to the substrate. The bridge includes a bridge substrate; at least one first bridge dielectric layer coupled to a first surface of the bridge substrate; at least one first bridge interconnect located in the at least one first bridge dielectric layer; at least one second bridge dielectric layer coupled to a second surface of the bridge substrate; at least one second bridge interconnect located in the at least one second bridge dielectric layer; and at least one bridge interconnect that extends through the at least one first bridge dielectric layer and the bridge substrate.
