17827838. MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME
Organization Name
Inventor(s)
JUNGWOONG Cho of GYEONGJU-SI (KR)
MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17827838 titled 'MEMORY MODULE AND MEMORY SYSTEM INCLUDING THE SAME
Simplified Explanation
The patent application describes a memory system that includes a memory module and a memory controller. The memory module consists of a control device, a module temperature sensor, and multiple semiconductor memory devices for storing data. Each semiconductor memory device has a temperature measurement circuit to measure its internal temperature.
- The memory system generates a reference offset value based on the module temperature and the internal temperatures of the semiconductor memory devices.
- This reference offset value is used to perform thermal throttling of the memory module, which helps prevent physical damage to the semiconductor memory devices.
- By dynamically generating the reference offset value based on the real internal temperatures, the memory system can adjust the thermal throttling accordingly.
Potential applications of this technology:
- Data centers and server farms where memory modules are used extensively.
- High-performance computing systems that require efficient memory management.
- Mobile devices and laptops to optimize memory performance and prevent overheating.
Problems solved by this technology:
- Prevents physical damage to semiconductor memory devices by implementing thermal throttling.
- Ensures efficient memory management by dynamically adjusting thermal throttling based on real internal temperatures.
Benefits of this technology:
- Reduces the risk of physical damage to memory devices, increasing their lifespan.
- Optimizes memory performance by adjusting thermal throttling based on real-time internal temperatures.
- Enhances overall system reliability and stability by preventing overheating of memory modules.
Original Abstract Submitted
A memory system includes a memory module and a memory controller. The memory module includes a control device, a module temperature sensor configured to measure a module temperature and a plurality of semiconductor memory devices configured to store data. The plurality of semiconductor memory devices respectively include a plurality of temperature measurement circuits configured to measure a plurality of internal temperatures respectively corresponding to the plurality of semiconductor memory devices. The memory system is configured to generate a reference offset value based on the module temperature and the plurality of internal temperatures and perform a thermal throttling of the memory module based on the reference offset value and the module temperature. Physical damage to the semiconductor memory devices is reduced by dynamically generating the reference offset value based on the real internal temperatures of the semiconductor memory devices to perform the thermal throttling based on the reference offset value.
