17818561. PHOTOCURABLE COMPOSITION simplified abstract (CANON KABUSHIKI KAISHA)
Contents
PHOTOCURABLE COMPOSITION
Organization Name
Inventor(s)
Timothy Brian Stachowiak of Austin TX (US)
Weijun Liu of Cedar Park TX (US)
PHOTOCURABLE COMPOSITION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17818561 titled 'PHOTOCURABLE COMPOSITION
Simplified Explanation
The patent application describes a photocurable composition containing a polymerizable material and a photoinitiator, with specific compositions and properties for use in various processes.
- The composition includes a high amount of multi-functional acrylate monomer (at least 75 wt %) and a minimum of 5 wt % of mono-functional monomer.
- The mono-functional monomer has a ring parameter of at least 0.5%.
- The total carbon content of the composition after curing is at least 69%.
- The composition has low thermal shrinkage after curing, high etch resistance, and is suitable for processes like AIP or NIL.
Potential Applications:
- Microelectronics manufacturing
- 3D printing
- Medical device fabrication
Problems Solved:
- Improving thermal shrinkage in cured materials
- Enhancing etch resistance in photopolymer materials
Benefits:
- Increased durability and stability in cured materials
- Compatibility with advanced processing techniques
- Versatile applications in various industries
Original Abstract Submitted
A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material can comprise at least one multi-functional acrylate monomer in an amount of at least 75 wt % based on the total weight of the polymerizable material and at least one mono-functional monomer in an amount of at least 5 wt % based on the total weight of the polymerizable material. The at least one mono-functional monomer can have a ring parameter of at least 0.5, and a total carbon content of the photocurable composition after curing may be at least 69%. The photocurable composition may have a low thermal shrinkage after curing, a high etch resistance and be suitable for AIP or NIL processing.
