17816619. SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
Organization Name
Inventor(s)
SEUNGHYUN Cho of CHEONAN-SI (KR)
JEONG-KYU Ha of HWASEONG-Sl (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17816619 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes a base film with folding sections and mount sections. Two semiconductor chips are placed on the mount sections, and test pads are connected to the chips. The folding sections overlap each other and bury the test pads.
- The semiconductor package includes a base film with folding and mount sections.
- Two semiconductor chips are placed on the mount sections of the base film.
- Test pads are connected to the chips and located on the folding sections of the base film.
- The folding sections overlap each other, burying the test pads.
Potential Applications
- Semiconductor manufacturing industry
- Electronics industry
Problems Solved
- Provides a compact and efficient design for semiconductor packaging.
- Ensures proper connection and testing of semiconductor chips.
Benefits
- Saves space and reduces the size of semiconductor packages.
- Improves the reliability and performance of semiconductor chips.
- Simplifies the manufacturing process of semiconductor packages.
Original Abstract Submitted
A semiconductor package includes a base film having a first mount section, a first folding section, a second folding section, and a second mount section. A first semiconductor chip is disposed on the first mount section of the base film. A second semiconductor chip is disposed on the second mount section of the base film. Test pads are disposed on the first or second folding sections of the base film and is connected to each of the first and second semiconductor chips. Connection pads are disposed on the first or second mount sections of the base film and are connected to each of the first and second semiconductor chips. The first and second folding sections vertically overlap each other. The test pads are interposed between and buried by the first and second folding sections.
