17806280. VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

From WikiPatents
Jump to navigation Jump to search

VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Kisik Choi of Watervliet NY (US)

SOMNATH Ghosh of CLIFTON PARK NY (US)

Julien Frougier of Albany NY (US)

Stuart Sieg of Albany NY (US)

Kevin Shawn Petrarca of Newburgh NY (US)

VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK - A simplified explanation of the abstract

This abstract first appeared for US patent application 17806280 titled 'VIA CONNECTION TO BACKSIDE POWER DELIVERY NETWORK

Simplified Explanation

The abstract of the patent application describes a semiconductor structure that includes a middle-of-line contact, a backside power rail, and a contact via connecting them. The contact via has two portions - a first portion with a negative tapered profile and a second portion with a positive tapered profile.

  • The semiconductor structure includes a middle-of-line contact, a backside power rail, and a contact via.
  • The contact via connects the middle-of-line contact and the backside power rail.
  • The contact via has a first portion with a negative tapered profile.
  • The contact via also has a second portion with a positive tapered profile.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Electronics industry
  • Integrated circuit design and fabrication

Problems solved by this technology:

  • Efficient and reliable connection between middle-of-line contacts and backside power rails in a semiconductor structure
  • Improved electrical performance and signal transmission

Benefits of this technology:

  • Enhanced performance and reliability of semiconductor devices
  • Improved power distribution and signal integrity
  • Increased efficiency in semiconductor manufacturing processes


Original Abstract Submitted

A semiconductor structure including a middle-of-line contact, a backside power rail, and a contact via extending between the middle-of-line contact and the backside power rail, wherein the contact via comprises a first portion having a negative tapered profile and a second portion having a positive tapered profile.