17804742. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
JU HYUNG Lee of Siheung-si (KR)
SUN CHUL Kim of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17804742 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The abstract describes a method of fabricating a semiconductor package. Here is a simplified explanation of the abstract:
- The method involves placing a preliminary semiconductor package on a stage.
- The preliminary semiconductor package consists of a substrate with a pad part attached, an interposer placed on the substrate, and a semiconductor chip positioned between the substrate and the interposer.
- A bonding tool is placed on the interposer, which has two regions - a first region and a second region outside of the first region.
- The second region of the bonding tool corresponds to the pad part on the substrate.
- The interposer and the substrate are bonded together using this method.
Potential applications of this technology:
- Semiconductor packaging industry
- Electronics manufacturing
Problems solved by this technology:
- Efficient bonding of the interposer and substrate in semiconductor packaging
- Simplified fabrication process
Benefits of this technology:
- Improved reliability and performance of semiconductor packages
- Cost-effective manufacturing process
- Enhanced productivity in the semiconductor packaging industry
Original Abstract Submitted
A method of fabricating a semiconductor package includes disposing a preliminary semiconductor package on a stage, the preliminary semiconductor package including a substrate to which a pad part is attached, an interposer disposed on the substrate, and a semiconductor chip disposed between the substrate and the interposer. A bonding tool is disposed on the interposer. The bonding tool includes a first region and a second region outside of the first region. The second region of the bonding tool corresponds to the pad part. The interposer and the substrate are bonded to each other.
