17765595. METHODS AND DEVICES FOR PROCESSING AND RETRIEVING DEFECT INFORMATION OF PRODUCT simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

METHODS AND DEVICES FOR PROCESSING AND RETRIEVING DEFECT INFORMATION OF PRODUCT

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Haijin Wang of Beijing (CN)

Chuan Wang of Beijing (CN)

Tian Lan of Beijing (CN)

Jianmin Wu of Beijing (CN)

Yu Feng of Beijing (CN)

Hong Wang of Beijing (CN)

Yu Wang of Beijing (CN)

Fan Zhang of Beijing (CN)

Jiawei Ren of Beijing (CN)

Jing Xue of Beijing (CN)

Jianfeng Zeng of Beijing (CN)

METHODS AND DEVICES FOR PROCESSING AND RETRIEVING DEFECT INFORMATION OF PRODUCT - A simplified explanation of the abstract

This abstract first appeared for US patent application 17765595 titled 'METHODS AND DEVICES FOR PROCESSING AND RETRIEVING DEFECT INFORMATION OF PRODUCT

Simplified Explanation

The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer. According to this, for the defect information on the current film layer, only the defect information caused by factors of the current film layer may be retained, and the defect information caused by the historical film layers will not be retained, and thus, on the one hand, the stored data volume may be reduced, and on the other hand, the complexity of subsequent analysis of defect information may be simplified.

• Simplified Explanation:

- Method for processing defect information of a product by analyzing current and historical film layers to determine which defects to retain or delete based on their origins.

• Potential Applications:

- Quality control in manufacturing processes - Film production industry

• Problems Solved:

- Reducing data volume by retaining only relevant defect information - Simplifying analysis of defect information by eliminating irrelevant data

• Benefits:

- Improved efficiency in defect analysis - Cost savings by reducing unnecessary data storage

• Potential Commercial Applications:

- Semiconductor manufacturing - Film production companies

• Possible Prior Art:

- Similar methods may have been used in the semiconductor industry for defect analysis.

Questions: 1. How does this method compare to traditional defect analysis techniques? 2. What are the specific criteria used to determine which defect information to retain or delete?

Original Abstract Submitted

The present disclosure provides a method for processing defect information of a product, which includes the following steps of: acquiring defect information on a current film layer and defect information on historical film layers; determining whether defect information exists at a target location of the historical film layer if defect information exists at a target location of the current film layer; if defect information exists for a corresponding location to the target location in at least one of the historical film layers, deleting the defect information detected at the target location in the current film layer; and if no defect information exists for the target location in any of the historical film layers, retaining the defect information detected at the target location in the current film layer. According to this, for the defect information on the current film layer, only the defect information caused by factors of the current film layer may be retained, and the defect information caused by the historical film layers will not be retained, and thus, on the one hand, the stored data volume may be reduced, and on the other hand, the complexity of subsequent analysis of defect information may be simplified.