17753246. DISPLAY SUBSTRATE, MANUFACTURING METHOD, DISPLAY MOTHERBOARD, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

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DISPLAY SUBSTRATE, MANUFACTURING METHOD, DISPLAY MOTHERBOARD, AND DISPLAY DEVICE

Organization Name

BOE TECHNOLOGY GROUP CO., LTD.

Inventor(s)

Jiarong Liu of Beijing (CN)

Heng Wang of Beijing (CN)

Zhixiao Yao of Beijing (CN)

DISPLAY SUBSTRATE, MANUFACTURING METHOD, DISPLAY MOTHERBOARD, AND DISPLAY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17753246 titled 'DISPLAY SUBSTRATE, MANUFACTURING METHOD, DISPLAY MOTHERBOARD, AND DISPLAY DEVICE

Simplified Explanation

The present disclosure describes a display substrate with a sealing cavity for a liquid crystal layer, a sealant, and a bonding side surface for attachment to a chip on film. The array substrate includes a display region and a non-display region with a bonding pin exposed on the side surface.

  • Display substrate with sealing cavity and bonding side surface:

- The display substrate consists of an array substrate, a color filter substrate, a liquid crystal layer, and a sealant. - The sealant defines a sealing cavity for the liquid crystal layer and includes a first portion with a bonding side surface. - The bonding side surface is flush with the sealant and is used for bonding to a chip on film.

  • Array substrate with display and non-display regions:

- The array substrate contains a display region and a non-display region surrounding it. - A bonding pin is located in the non-display region, extending to the side surface of the display substrate and exposed externally.

    • Potential Applications:**

This technology can be applied in the manufacturing of display devices such as LCD screens, televisions, monitors, and mobile devices.

    • Problems Solved:**

This innovation solves the problem of securely sealing the liquid crystal layer within the display substrate while providing a bonding side surface for attachment to external components.

    • Benefits:**

- Improved display substrate design for enhanced performance and durability. - Secure sealing of the liquid crystal layer for long-lasting display functionality. - Simplified manufacturing process for display devices.

    • Potential Commercial Applications of this Technology:**

- Consumer electronics industry for the production of high-quality display devices. - Display manufacturing companies looking to enhance their product offerings with improved substrate design.

    • Possible Prior Art:**

One possible prior art could be the use of traditional sealants and bonding methods in display substrate manufacturing processes. However, the specific design of the bonding side surface and the exposed bonding pin may be unique to this innovation.

    • Unanswered Questions:**

1. How does the bonding pin in the non-display region affect the overall structural integrity of the display substrate? 2. Are there any specific requirements or limitations for the chip on film that is bonded to the display substrate's bonding side surface?


Original Abstract Submitted

The present disclosure provides a display substrate, including an array substrate, a color filter substrate, and a liquid crystal layer and a sealant arranged therebetween. A sealing cavity for receiving the liquid crystal layer is defined by the sealant, the array substrate and the color filter substrate. The display substrate is provided with a bonding side surface bonded to a chip on film, the sealant at least includes a first portion including a first side surface and a second side surface flush with the bonding side surface. The array substrate includes a display region and a non-display region surrounding the display region. A bonding pin is provided in the non-display region, extends to a side surface of the display substrate, and is exposed to the outside. The present disclosure further provides a method for manufacturing the display substrate, a display motherboard, and a display device.