17750924. FINGERPRINT SENSOR PACKAGE AND SENSOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
FINGERPRINT SENSOR PACKAGE AND SENSOR PACKAGE
Organization Name
Inventor(s)
Younghwan Park of Hwaseong-si (KR)
FINGERPRINT SENSOR PACKAGE AND SENSOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17750924 titled 'FINGERPRINT SENSOR PACKAGE AND SENSOR PACKAGE
Simplified Explanation
The abstract describes a fingerprint sensor package that includes various components such as a film substrate, interconnection substrate, semiconductor chip, conductive structure, and interposer substrate.
- The conductive structure is laterally isolated from direct contact with the semiconductor chip.
- The conductive structure consists of two separate conductive structures that are electrically separated from each other.
- The interposer substrate has a first sensing pattern connected to the first conductive structure and a second sensing pattern connected to the second conductive structure.
- The second sensing pattern is vertically isolated from direct contact with the first sensing pattern.
- The second sensing pattern is oriented with a longitudinal axis parallel to a direction crossing the longitudinal axis of the first sensing pattern.
Potential applications of this technology:
- Fingerprint recognition systems
- Biometric authentication devices
- Access control systems
- Mobile devices with fingerprint sensors
Problems solved by this technology:
- Improved isolation between the conductive structures and the semiconductor chip
- Enhanced accuracy and reliability of fingerprint sensing
- Reduction of cross-talk or interference between the sensing patterns
Benefits of this technology:
- Higher security and accuracy in fingerprint recognition
- Improved durability and longevity of the fingerprint sensor package
- Compatibility with various devices and applications
Original Abstract Submitted
A fingerprint sensor package may include a film substrate, an interconnection substrate on the film substrate, a semiconductor chip on the interconnection substrate, a conductive structure on the interconnection substrate and laterally isolated from direct contact with the semiconductor chip, and an interposer substrate on the semiconductor chip and the conductive structure. The conductive structure may include first and second conductive structures, which are electrically separated from each other. The interposer substrate may include a first sensing pattern electrically connected to the first conductive structure and a second sensing pattern on a top surface of the first sensing pattern and electrically connected to the second conductive structure. The second sensing pattern may be vertically isolated from direct contact with from the first sensing pattern. The second sensing pattern may have a longitudinal axis parallel to a direction crossing a longitudinal axis of the first sensing pattern, in a plan view.
