17745666. SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES
Organization Name
Inventor(s)
SEUNGHOON Yeon of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17745666 titled 'SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES
Simplified Explanation
The abstract describes a semiconductor package that consists of two semiconductor chips connected by bump structures. These bump structures have different shapes and are made up of two layers, one associated with each chip.
- The semiconductor package includes two semiconductor chips connected by bump structures.
- The bump structures have different shapes, with some having a first shape and others having a second shape.
- Each bump structure consists of two layers: a first pillar layer associated with the first semiconductor chip and a second pillar layer associated with the second semiconductor chip.
Potential Applications:
- This technology can be used in various electronic devices that require multiple semiconductor chips to be connected.
- It can be applied in the manufacturing of advanced processors, memory modules, and integrated circuits.
Problems Solved:
- The use of different bump structures with different shapes allows for more efficient and reliable connections between the semiconductor chips.
- This technology addresses the challenge of connecting multiple chips with different requirements and shapes.
Benefits:
- The different bump structures provide flexibility in connecting semiconductor chips with varying shapes and requirements.
- The use of two layers in each bump structure enhances the reliability and performance of the connections.
- This technology enables the development of more advanced and compact electronic devices.
Original Abstract Submitted
A semiconductor package includes; a first semiconductor chip and a second semiconductor chip connected by bump structures, wherein the bump structures include first bump structures having a first shape and second bump structures having a second shape different from the first shape, and each of the bump structures includes a first pillar layer associated with the first semiconductor chip and a second pillar layer associated with the second semiconductor chip.
