17742667. COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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Contents
- 1 COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION
Organization Name
Inventor(s)
Inoue Naoki of Seongnam-si (KR)
Hyunwoo Kim of Seongnam-si (KR)
Tsunehiro Nishi of Suwon-si (KR)
COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17742667 titled 'COMPOUND FOR FORMING HARDMASK, HARDMASK COMPOSITION INCLUDING THE COMPOUND, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE HARDMASK COMPOSITION
Simplified Explanation
The abstract describes a patent application for a hardmask-forming compound, a hardmask composition, and a method of manufacturing an integrated circuit (IC). The compound includes a specific moiety represented by Formula 1.
- The patent application is for a new compound that can be used to create a hardmask, which is a protective layer used in the manufacturing of integrated circuits.
- The compound includes a specific moiety represented by Formula 1, which is a specific chemical structure.
- The invention also includes a composition that contains the compound and can be used as a hardmask.
- The method of manufacturing an integrated circuit using this compound and composition is also described in the patent application.
Potential Applications
- This technology can be used in the manufacturing of integrated circuits.
- It can be applied in the semiconductor industry for the production of electronic devices.
Problems Solved
- The invention solves the problem of creating a hardmask for integrated circuit manufacturing.
- It provides a new compound and composition that can be used as a hardmask, improving the manufacturing process.
Benefits
- The compound and composition described in the patent application offer a more efficient and effective way to create a hardmask.
- The method of manufacturing an integrated circuit using this technology can lead to improved performance and reliability of electronic devices.
Original Abstract Submitted
A hardmask-forming compound, a hardmask composition, and a method of manufacturing an integrated circuit (IC), the hardmask-forming compound including a moiety represented by Formula 1:
