17736352. CHIP TRANSFER APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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CHIP TRANSFER APPARATUS

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Dongkyun Kim of Suwon-si (KR)

Hyunjoon Kim of Suwon-si (KR)

Joonyong Park of Suwon-si (KR)

Seogwoo Hong of Yongin-si (KR)

Kyungwook Hwang of Seoul (KR)

CHIP TRANSFER APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17736352 titled 'CHIP TRANSFER APPARATUS

Simplified Explanation

The patent application describes a chip transfer apparatus that is used to transfer micro-semiconductor chips onto a transfer substrate. The apparatus includes three main modules: a chip storage module, a chip filtration module, and a chip supply module.

  • The chip storage module stores both micro-semiconductor chips and a suspension that contains impurities.
  • The chip filtration module separates the micro-semiconductor chips from the impurities in the suspension.
  • The chip supply module supplies the filtered suspension onto the transfer substrate, allowing the micro-semiconductor chips to flow onto it.

Potential applications of this technology:

  • Semiconductor manufacturing: The chip transfer apparatus can be used in the production of micro-semiconductor chips, allowing for efficient and controlled transfer of chips onto substrates.
  • Electronics assembly: The apparatus can be utilized in the assembly of electronic devices, ensuring precise placement of micro-semiconductor chips onto the appropriate substrates.

Problems solved by this technology:

  • Contamination control: The chip filtration module effectively separates the micro-semiconductor chips from impurities in the suspension, ensuring that only clean chips are transferred onto the substrate.
  • Chip transfer efficiency: The chip supply module enables the flow of micro-semiconductor chips onto the transfer substrate, improving the efficiency and accuracy of chip transfer processes.

Benefits of this technology:

  • Improved chip quality: By filtering out impurities, the apparatus ensures that only high-quality micro-semiconductor chips are transferred onto the substrate.
  • Enhanced production efficiency: The chip transfer apparatus allows for faster and more precise chip transfer, leading to increased production efficiency and reduced manufacturing time and costs.


Original Abstract Submitted

A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.