17735747. DEVICE TRANSFER SUBSTRATE, DEVICE TRANSFER STRUCTURE, AND DISPLAY APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
DEVICE TRANSFER SUBSTRATE, DEVICE TRANSFER STRUCTURE, AND DISPLAY APPARATUS
Organization Name
Inventor(s)
Joonyong Park of Suwon-si (KR)
Seogwoo Hong of Yongin-si (KR)
Junsik Hwang of Hwaseong-si (KR)
DEVICE TRANSFER SUBSTRATE, DEVICE TRANSFER STRUCTURE, AND DISPLAY APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17735747 titled 'DEVICE TRANSFER SUBSTRATE, DEVICE TRANSFER STRUCTURE, AND DISPLAY APPARATUS
Simplified Explanation
The abstract describes a device transfer substrate with multiple recesses, each having two different shapes and an overlapping region. The maximum width of the overlapping region is smaller than the diameter or diagonal length of either shape.
- The device transfer substrate has multiple recesses with different shapes.
- Each recess has a first region in the shape of a first figure and a second region in the shape of a second figure.
- The first region partially overlaps with the second region in an overlapping region.
- The maximum width of the overlapping region is smaller than the diameter or diagonal length of either figure.
Potential applications of this technology:
- Semiconductor manufacturing: The device transfer substrate can be used in the production of semiconductor devices, allowing for precise transfer and alignment of components.
- Microelectronics: This technology can be applied in the fabrication of microelectronic devices, ensuring accurate placement of components.
- Optoelectronics: The device transfer substrate can be utilized in the manufacturing of optoelectronic devices, enabling precise positioning of optical components.
Problems solved by this technology:
- Alignment accuracy: The overlapping region ensures precise alignment between the first and second figures, improving the accuracy of component placement.
- Transfer efficiency: The device transfer substrate allows for efficient transfer of components by providing a secure and stable platform for alignment and placement.
Benefits of this technology:
- Improved manufacturing precision: The overlapping region ensures accurate alignment between different shapes, resulting in higher precision in component placement.
- Enhanced production efficiency: The device transfer substrate enables efficient transfer of components, reducing production time and costs.
- Versatile application: This technology can be applied in various industries, including semiconductor, microelectronics, and optoelectronics, providing a versatile solution for precise component placement.
Original Abstract Submitted
A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.
