17730550. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Taehyeong Kim of Suwon-si (KR)

Hyeonjun Song of Hwaseong-si (KR)

Jungseok Ahn of Seoul (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17730550 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract describes a semiconductor package design that includes multiple substrates, bump pads, a bump structure, and a non-conductive film. Here is a simplified explanation of the abstract:

  • The semiconductor package consists of a first substrate with a bump pad and a filling compensation film (FCF) around it.
  • There is a second substrate facing the first substrate, which also has a bump pad.
  • A bump structure (BS) is in contact with both the first and second bump pads.
  • A non-conductive film (NCF) surrounds the bump structure and is located between the first and second substrates.
  • The NCF covers the upper surface and the edge of the FCF.

Potential applications of this technology:

  • Semiconductor packaging for electronic devices such as smartphones, tablets, and computers.
  • Integrated circuits and microprocessors used in various electronic systems.
  • High-speed communication devices and networking equipment.

Problems solved by this technology:

  • Provides improved electrical connectivity and reliability between the substrates and bump pads.
  • Reduces the risk of short circuits and other electrical failures.
  • Enhances the overall performance and durability of the semiconductor package.

Benefits of this technology:

  • Enhanced electrical connectivity and reliability.
  • Improved resistance to short circuits and other electrical failures.
  • Increased performance and durability of the semiconductor package.
  • Potential for smaller and more compact electronic devices.


Original Abstract Submitted

A semiconductor package including a first substrate including a first bump pad and a filling compensation film (FCF) around the first bump pad; a second substrate facing the first substrate and including a second bump pad; a bump structure (BS) in contact with the first bump pad and the second bump pad; and a non-conductive film (NCF) surrounding the BS and between the first substrate and the second substrate, wherein the NCF covers an upper surface and an edge of the FCF.

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