17729734. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

JAE-MIN Jung of Seoul (KR)

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17729734 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The patent application describes semiconductor packages and their fabrication methods. These packages consist of a circuit substrate, a semiconductor chip mounted on the substrate, and a thermal radiation film covering the chip.

  • The semiconductor chip has first and second lateral surfaces in different directions, with the first lateral surface being narrower than the second lateral surface.
  • The thermal radiation film covers the top surface of the chip and completely surrounds the first and second lateral surfaces.
  • The film also has slits that are directed towards the first lateral surfaces from the ends of the film.

Potential applications of this technology:

  • This technology can be used in various electronic devices that require efficient heat dissipation, such as smartphones, laptops, and servers.
  • It can also be applied in automotive electronics, aerospace systems, and other high-performance electronic devices.

Problems solved by this technology:

  • The thermal radiation film helps in dissipating heat generated by the semiconductor chip, preventing overheating and potential damage to the chip.
  • The slits in the film allow for better airflow and heat transfer, enhancing the overall cooling efficiency of the package.

Benefits of this technology:

  • The semiconductor package with the thermal radiation film provides improved heat dissipation, leading to better performance and reliability of the electronic device.
  • The design of the package allows for efficient cooling without the need for additional cooling mechanisms, reducing the overall size and complexity of the device.
  • The fabrication methods described in the patent application provide a cost-effective and scalable approach for producing these semiconductor packages.


Original Abstract Submitted

Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a circuit substrate, a semiconductor chip mounted on the circuit substrate, and a thermal radiation film covering the semiconductor chip on the circuit substrate. The semiconductor chip includes first lateral surfaces opposite to each other in a first direction and second lateral surfaces opposite to each other in a second direction that intersects the first direction. A first width of the first lateral surface is less than a second width of the second lateral surface. The thermal radiation film covers a top surface of the semiconductor chip and entirely surrounds the first and second lateral surfaces of the semiconductor chip. The thermal radiation film has slits directed toward the first lateral surfaces from ends of the thermal radiation film.

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