17728275. IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
Organization Name
Inventor(s)
Yonghoe Cho of Cheonan-si (KR)
IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17728275 titled 'IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
Simplified Explanation
The abstract describes an image sensor package that includes a package base substrate, an image sensor chip, a filter glass, and connection terminals.
- The package base substrate has a cavity and connection pads on its upper and lower surfaces.
- The image sensor chip is placed inside the cavity and has a sensor unit and chip pads.
- The filter glass is positioned above the image sensor chip and has redistribution patterns on its lower surface.
- Connection terminals are used to connect the redistribution patterns to the chip pads and upper surface connection pads.
Potential Applications
- This image sensor package can be used in various electronic devices that require image capturing capabilities, such as smartphones, digital cameras, and surveillance systems.
Problems Solved
- The package provides a protective and compact housing for the image sensor chip, ensuring its proper functioning and longevity.
- The connection terminals facilitate the transfer of signals between the image sensor chip and other components, enabling seamless integration within electronic devices.
Benefits
- The package design allows for efficient and reliable image capturing, enhancing the overall performance of electronic devices.
- The compact size of the package enables the integration of image sensor technology in smaller and more portable devices.
- The connection terminals ensure stable and accurate signal transmission, resulting in high-quality image capture.
Original Abstract Submitted
An image sensor package includes: a package base substrate having a cavity extending inwards from an upper surface thereof, and including a plurality of upper surface connection pads and a plurality of lower surface connection pads; an image sensor chip in the cavity, and including a chip body having a first surface and a second surface facing each other, a sensor unit located in the first surface of the chip body, and a plurality of chip pads around the sensor unit; a filter glass above the image sensor chip, and including a transparent substrate and a plurality of redistribution patterns on a lower surface of the transparent substrate; and a plurality of connection terminals between the plurality of redistribution patterns and the plurality of chip pads and between the plurality of redistribution patterns and the plurality of upper surface connection pads.
