17722838. WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER simplified abstract (Samsung Electronics Co., Ltd.)

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WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Jinhyuk Choi of Suwon-si (KR)

Myungki Song of Hwaseong-si (KR)

Kongwoo Lee of Seoul (KR)

Kyusang Lee of Suwon-si (KR)

Beomsoo Hwang of Seoul (KR)

Keonwoo Kim of Yongin-si (KR)

Jonghwi Seo of Suwon-si (KR)

WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER - A simplified explanation of the abstract

This abstract first appeared for US patent application 17722838 titled 'WAFER PROCESSING APPARATUS INCLUDING EFEM AND METHOD OF PROCESSING WAFER

Simplified Explanation

The abstract describes a wafer processing apparatus that includes multiple equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each EFEM consists of an EFEM chamber, several load ports located on the side of the chamber, and a load lock that overlaps with at least one load port vertically.

  • The wafer processing apparatus is designed to handle wafer processing in a semiconductor manufacturing environment.
  • It includes multiple EFEMs, which are modules that facilitate the transfer of wafers between different chambers.
  • Each EFEM has an EFEM chamber, load ports, and a load lock.
  • The load ports are positioned on the side of the EFEM chamber, allowing for easy loading and unloading of wafers.
  • The load lock overlaps with at least one load port vertically, ensuring a secure seal during the transfer process.
  • The wafer transfer chamber and wafer processing chamber are also part of the apparatus, enabling the movement and processing of wafers.
  • The wafer transfer arm is responsible for transferring wafers between the EFEMs, transfer chamber, and processing chamber.

Potential Applications

  • Semiconductor manufacturing: The wafer processing apparatus can be used in semiconductor fabrication facilities to handle the processing of wafers.

Problems Solved

  • Efficient wafer transfer: The apparatus solves the problem of efficiently transferring wafers between different chambers in a semiconductor manufacturing environment.
  • Secure sealing: The load lock overlapping with the load ports ensures a secure seal during the transfer process, preventing contamination or damage to the wafers.

Benefits

  • Improved productivity: The apparatus allows for efficient and seamless transfer of wafers, reducing downtime and increasing overall productivity.
  • Enhanced wafer protection: The secure sealing provided by the load lock prevents contamination or damage to the wafers during the transfer process.


Original Abstract Submitted

A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.