17720064. SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS
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SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17720064 titled 'SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate, a first semiconductor chip, and a second semiconductor chip stacked on the substrate. The second chip protrudes beyond the side surface of the first chip and is held in place by an adhesive member that extends below the first chip's upper surface and contacts its side surface.
- The semiconductor package includes a package substrate, first and second semiconductor chips, and an adhesive member.
- The first and second semiconductor chips are stacked on the package substrate in an offset stack structure.
- The second semiconductor chip extends beyond the side surface of the first chip in a horizontal direction.
- The adhesive member is located on the lower surface of the second chip and extends below the upper surface of the first chip.
- The extension of the adhesive member contacts the side surface of the first chip and overlaps with at least a portion of the overhang of the second chip in a vertical direction.
Potential applications of this technology:
- Semiconductor packaging for electronic devices such as smartphones, tablets, and computers.
- Integrated circuits and microprocessors used in various industries, including automotive, aerospace, and telecommunications.
Problems solved by this technology:
- Provides a secure and stable stacking structure for semiconductor chips.
- Helps prevent misalignment and damage during assembly and operation.
- Improves thermal management and electrical connectivity between chips.
Benefits of this technology:
- Enhanced reliability and performance of semiconductor packages.
- Improved heat dissipation and thermal management.
- Enables compact and efficient design of electronic devices.
- Reduces manufacturing costs and improves production yield.
Original Abstract Submitted
A semiconductor package includes a package substrate, a first semiconductor chip and a second semiconductor chip sequentially stacked on the package substrate, the first semiconductor chip and the second semiconductor chip being disposed in a form of an offset stack structure, and the second semiconductor chip including an overhang further protruding beyond a side surface of the first semiconductor chip in a first horizontal direction, an adhesive member disposed on a lower surface of the second semiconductor chip, the adhesive member including an extension extending to a lower level than an upper surface of the first semiconductor chip. The extension contacts the side surface of the first semiconductor chip, and overlaps with at least a portion of the overhang in a vertical direction.
