17715782. SUBSTRATE TRANSFER DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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SUBSTRATE TRANSFER DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sanglyong Shin of Cheonan-Si (KR)

SUBSTRATE TRANSFER DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17715782 titled 'SUBSTRATE TRANSFER DEVICE

Simplified Explanation

The disclosed semiconductor transfer device is designed to securely hold a substrate within a housing during transfer processes. The device includes a lower support that extends onto the bottom surface of the substrate and an upper support with a second hold member that contacts the top surface of the substrate. An extension part protrudes onto the outer surface of the housing.

  • The device has a housing with an opening for substrate introduction.
  • A substrate hold structure fixes the substrate in the housing.
  • The lower support extends onto the bottom surface of the substrate.
  • The upper support extends towards the side of the substrate and includes a second hold member.
  • The second hold member moves onto the substrate, overlapping the first hold member.
  • An extension part penetrates the housing and protrudes onto the outer surface.

Potential Applications

  • Semiconductor manufacturing processes
  • Transfer of delicate substrates in various industries

Problems Solved

  • Ensures secure and stable holding of substrates during transfer
  • Prevents damage or misalignment of substrates

Benefits

  • Improved efficiency and accuracy in substrate transfer
  • Reduces the risk of substrate damage or loss during transfer


Original Abstract Submitted

Disclosed is a semiconductor transfer device comprising a housing having a surface that has an opening through which a substrate is introduced, and a substrate hold structure that fixes the substrate in the housing. The substrate hold structure includes a lower support that extends onto a bottom surface of the substrate from one of inner surfaces of the housing, and an upper support that extends toward a side of the substrate from one of the inner surfaces of the housing and includes a second hold member. An operation of the upper support causes the second hold member to move onto the substrate such that the second hold member contacts a top surface of the substrate and overlaps the first hold member. An extension part penetrates the housing and protrudes onto an outer surface of the housing.

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