17714363. SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
SOOKYEOM Yong of Gunpo-si (KR)
SANGYUB Ie of Hwaseong-si (KR)
SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17714363 titled 'SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD USING THE SAME
Simplified Explanation
The patent application describes a semiconductor processing apparatus that consists of an outer tube, an inner tube, and a nozzle. The inner tube creates a process space, while the nozzle has an internal passage and multiple holes. The inner tube also has a vertical slit that exposes some of the holes. The internal passage connects to the process space through the slit and the holes.
- The semiconductor processing apparatus includes an outer tube, inner tube, and nozzle.
- The inner tube creates a process space, while the nozzle has an internal passage and multiple holes.
- The inner tube has a vertical slit that exposes some of the holes.
- The internal passage connects to the process space through the slit and the holes.
Potential Applications:
- Semiconductor manufacturing
- Integrated circuit fabrication
- Thin film deposition processes
Problems Solved:
- Provides a simplified and efficient method for semiconductor processing.
- Allows for precise control and distribution of process gases.
- Enhances the uniformity and quality of semiconductor materials.
Benefits:
- Improved semiconductor manufacturing efficiency.
- Enhanced control over process gases.
- Higher quality and uniformity of semiconductor materials.
Original Abstract Submitted
A semiconductor processing apparatus includes an outer tube, an inner tube in the outer tube and providing a process space, and a nozzle between the outer tube and the inner tube. The nozzle provides an internal passage. The inner tube provides a slit. The nozzle provides a plurality of holes. The plurality of holes are vertically spaced apart from each other. The slit vertically extends to expose at least two of the plurality of holes. The internal passage is connected to the process space through the slit and the plurality of holes.
