17706324. SEMICONDUCTOR MEMORY DEVICE AND METHOD PROVIDING LOG INFORMATION simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR MEMORY DEVICE AND METHOD PROVIDING LOG INFORMATION
Organization Name
Inventor(s)
BOAYEONG Oh of HWASEONG-SI (KR)
KWANGHYUN Kim of SEONGNAM-SI (KR)
SEMICONDUCTOR MEMORY DEVICE AND METHOD PROVIDING LOG INFORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 17706324 titled 'SEMICONDUCTOR MEMORY DEVICE AND METHOD PROVIDING LOG INFORMATION
Simplified Explanation
The patent application describes a semiconductor memory device that includes a memory semiconductor die and a test chip stacked vertically. The memory semiconductor die has a volatile memory device that performs normal operations in response to commands and addresses from a host device. The test chip has a nonvolatile memory device and is configured to store log information corresponding to commands and addresses received by the memory device in normal mode. In debugging mode, the test chip can read the log information from the nonvolatile memory device.
- The memory device includes a volatile memory device and a test chip with a nonvolatile memory device.
- The test chip stores log information in normal mode and can read it in debugging mode.
- The log information corresponds to commands and addresses received by the memory device from the host device.
Potential Applications
- Debugging and troubleshooting of semiconductor memory devices.
- Monitoring and analyzing command and address data in memory devices.
Problems Solved
- Lack of efficient debugging and troubleshooting capabilities in semiconductor memory devices.
- Difficulty in monitoring and analyzing command and address data in memory devices.
Benefits
- Improved debugging and troubleshooting process for memory devices.
- Enhanced monitoring and analysis of command and address data.
- Efficient identification and resolution of issues in memory devices.
Original Abstract Submitted
A semiconductor memory device includes; a memory semiconductor die including a volatile memory device configured to perform a normal operation in response to at least one of a command and an address received from a host device, and a test chip vertically stacked with the memory semiconductor die and including a nonvolatile memory device. The test chip is configured in the normal mode to store log information corresponding to at least one of a command and an address received by the semiconductor memory device from the host device, and is further configured in a debugging mode to read the log information from the nonvolatile memory device.
