17704177. SEMICONDUCTOR CHIPS HAVING RECESSED REGIONS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR CHIPS HAVING RECESSED REGIONS
Organization Name
Inventor(s)
SEMICONDUCTOR CHIPS HAVING RECESSED REGIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17704177 titled 'SEMICONDUCTOR CHIPS HAVING RECESSED REGIONS
Simplified Explanation
The abstract describes a semiconductor chip that includes a semiconductor substrate with a device region and an edge region. It also includes a device layer, a wiring layer, and an upper insulating layer. The wiring layer has a side surface that partially defines a recessed region in the edge region, exposing the side surface. The upper insulating layer covers the exposed side surface of the wiring layer.
- The semiconductor chip includes a device region and an edge region.
- The wiring layer has a recessed region in the edge region, exposing its side surface.
- The upper insulating layer covers the exposed side surface of the wiring layer.
Potential Applications
- Integrated circuits
- Microprocessors
- Memory devices
Problems Solved
- Protecting the exposed side surface of the wiring layer
- Enhancing the performance and reliability of the semiconductor chip
Benefits
- Improved insulation and protection of the wiring layer
- Increased performance and reliability of the semiconductor chip
- Enables more efficient and compact semiconductor chip designs
Original Abstract Submitted
A semiconductor chip includes a semiconductor substrate including a device region, and an edge region surrounding the device region, a device layer on the semiconductor substrate, a wiring layer on the device layer, a side surface of the wiring layer at least partially defining a recessed region that is in the edge region such that the side surface of the wiring layer is exposed by the recessed region, and an upper insulating layer on the wiring layer. The recessed region extends from a side surface of the device layer toward the device region. A first portion of the upper insulating layer covers the side surface of the wiring layer that is exposed by the recessed region.
