17703668. SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17703668 titled 'SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES
Simplified Explanation
The abstract describes a patent application related to integrated circuit (IC) chips and seal ring structures. The IC chip includes a substrate with a device region and a ring region surrounding it. It also includes an interconnect structure, passivation layers, contact via rings, contact pad rings, and a polymer layer.
- The IC chip has a device region and a ring region surrounding it.
- An interconnect structure is placed on the substrate.
- A first passivation layer is added over the interconnect structure.
- A first contact via ring is embedded in the first passivation layer.
- A first contact pad ring is placed on the first contact via ring and the first passivation layer.
- A second passivation layer is added over the first contact pad ring.
- A polymer layer is placed on a portion of the second passivation layer.
- The first contact via ring and the first contact pad ring completely surround the device region.
Potential Applications
This technology can be applied in various fields where integrated circuit chips are used, such as:
- Electronics manufacturing
- Telecommunications
- Automotive industry
- Consumer electronics
Problems Solved
The patent application addresses the following problems:
- Ensuring proper connectivity and protection of the integrated circuit chip.
- Providing a seal ring structure that completely surrounds the device region.
- Enhancing the reliability and performance of the IC chip.
Benefits
The innovation described in the patent application offers several benefits:
- Improved connectivity and protection of the IC chip.
- Enhanced reliability and performance of the chip.
- Simplified manufacturing process for IC chips.
- Increased versatility and applicability in various industries.
Original Abstract Submitted
Integrated circuit (IC) chips and seal ring structures are provided. An IC chip according to the present disclosure includes a substrate that has a device region and a ring region surrounding the device region, an interconnect structure disposed on the substrate, a first passivation layer disposed over the interconnect structure, a first contact via ring embedded in the first passivation layer, a first contact pad ring disposed on the first contact via ring and the first passivation layer, a second passivation layer disposed over the first contact pad ring, and a polymer layer disposed on a portion of the second passivation layer. The first contact via ring and the first contact pad ring completely surround the device region.
