17703201. THIN FILM STRUCTURE AND ELECTRONIC DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL simplified abstract (Samsung Electronics Co., Ltd.)

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THIN FILM STRUCTURE AND ELECTRONIC DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Keunwook Shin of Yongin-si (KR)

Kyung-Eun Byun of Seongnam-si (KR)

Sangsoo Lee of Seongnam-si (KR)

Changhyun Kim of Seoul (KR)

Changseok Lee of Gwacheon-si (KR)

THIN FILM STRUCTURE AND ELECTRONIC DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL - A simplified explanation of the abstract

This abstract first appeared for US patent application 17703201 titled 'THIN FILM STRUCTURE AND ELECTRONIC DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL

Simplified Explanation

The patent application describes a thin film structure consisting of a substrate, a metal layer, and a two-dimensional material layer. The two-dimensional material layer acts as a barrier to prevent electron transfer between the substrate and the metal layer, while also reducing the resistivity of the metal layer.

  • The thin film structure includes a substrate, a metal layer, and a two-dimensional material layer.
  • The two-dimensional material layer is positioned between the substrate and the metal layer.
  • The two-dimensional material layer restricts or blocks electron transfer between the substrate and the metal layer.
  • The presence of the two-dimensional material layer lowers the resistivity of the metal layer.

Potential Applications

  • Electronics: The thin film structure can be used in electronic devices to improve conductivity and prevent unwanted electron transfer.
  • Solar Cells: The technology can be applied in solar cells to enhance their efficiency and performance.
  • Optoelectronics: The thin film structure can be utilized in optoelectronic devices to improve their functionality and reduce energy loss.

Problems Solved

  • Unwanted Electron Transfer: The two-dimensional material layer acts as a barrier to prevent electron transfer between the substrate and the metal layer, solving the problem of unwanted electrical conduction.
  • High Resistivity: The presence of the two-dimensional material layer lowers the resistivity of the metal layer, addressing the issue of high resistance in thin film structures.

Benefits

  • Improved Conductivity: The thin film structure enhances conductivity by limiting electron transfer between layers.
  • Enhanced Performance: By reducing resistivity, the technology improves the overall performance and efficiency of electronic and optoelectronic devices.
  • Energy Efficiency: The use of the two-dimensional material layer helps reduce energy loss in thin film structures, making them more energy-efficient.


Original Abstract Submitted

Provided is a thin film structure including a substrate, a metal layer on the substrate and spaced apart from the substrate, and a two-dimensional material layer between the substrate and the metal layer. The two-dimensional material layer may be configured to limit and/or block an electron transfer between the substrate and the metal layer. A resistivity of a metal layer on the two-dimensional material layer may be lowered by the two-dimensional material layer.

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