17702105. DEPOSITION APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
DEPOSITION APPARATUS
Organization Name
Inventor(s)
Byoungcheol Hwang of Suwon-si (KR)
Sangwook Lee of Gwangju-si (KR)
Sunghyup Kim of Hwaseong-si (KR)
Junyoung Choi of Suwon-si (KR)
Sanghoon Cheong of Suwon-si (KR)
DEPOSITION APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17702105 titled 'DEPOSITION APPARATUS
Simplified Explanation
The abstract describes a deposition apparatus used in a chamber for a specific process. Here are the key points:
- The apparatus includes a chamber with a gas inlet, a fixed chuck, and an electrostatic chuck.
- An edge ring is placed on the electrostatic chuck, and a shower head is positioned above it.
- A baffle is placed above the shower head, and an upper electrode is placed above the baffle.
- A gas guide member connects the flow path in the upper electrode with the gas inlet.
- The gas guide member has a flow path hole that goes up and down, and guide holes on its inner surface.
Potential applications of this technology:
- Semiconductor manufacturing: This deposition apparatus can be used in the production of semiconductors, where precise deposition of materials is crucial.
- Thin film coating: The apparatus can be used for depositing thin films on various substrates, such as glass, metal, or plastic.
- Solar cell production: Solar cells require specific deposition processes, and this apparatus can provide the necessary control and precision.
Problems solved by this technology:
- Precise deposition control: The apparatus allows for accurate and controlled deposition of materials, ensuring uniformity and quality.
- Enhanced adhesion: The use of an electrostatic chuck and edge ring helps improve the adhesion of the substrate to the chuck, preventing any movement or detachment during the deposition process.
- Efficient gas flow: The gas guide member ensures a smooth and consistent flow of gases, optimizing the deposition process.
Benefits of this technology:
- Improved deposition quality: The apparatus enables precise control over the deposition process, resulting in high-quality and uniform coatings.
- Enhanced productivity: The efficient gas flow and deposition control contribute to increased productivity and reduced production time.
- Versatility: The apparatus can be used for various deposition processes and on different types of substrates, making it a versatile tool in the manufacturing industry.
Original Abstract Submitted
A deposition apparatus, includes a chamber having at least one first gas inlet therein. A fixed chuck is installed in the chamber and an electrostatic chuck is installed on the fixed chuck. An edge ring is disposed on an edge of the electrostatic chuck. A shower head is disposed above the edge ring. A baffle is disposed above the shower head and an upper electrode is disposed above the baffle. A gas guide member is disposed above the upper electrode so that a flow path provided in the upper electrode and the first gas inlet are connected. The gas guide member has a flow path hole penetrating in upward and downward directions, and a plurality of guide holes are provided on an inner surface of the gas guide member.
