17701520. ELECTRONIC DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
ELECTRONIC DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE
Organization Name
Inventor(s)
Dongho Kim of Hwaseong-si (KR)
Sangwook Kim of Yongin-si (KR)
Jungmin Kim of Hwaseong-si (KR)
Changmook Yim of Hwaseong-si (KR)
ELECTRONIC DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17701520 titled 'ELECTRONIC DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE
Simplified Explanation
The patent application describes a method for operating an electronic device in the manufacturing of semiconductor devices. Here are the key points:
- The method involves receiving a design layout for the semiconductor device.
- A first layout is generated by using machine learning-based process proximity correction (PPC).
- A second layout is generated by using optical proximity correction (OPC).
- The second layout is then outputted for the semiconductor process.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronic device manufacturing companies
Problems solved by this technology:
- Improves the accuracy and precision of the manufacturing process for semiconductor devices.
- Reduces errors and defects in the final product.
Benefits of this technology:
- Enhanced manufacturing efficiency and productivity.
- Higher quality and reliability of semiconductor devices.
- Cost savings by minimizing errors and rework.
Original Abstract Submitted
Disclosed is an operating method of an electronic device which includes receiving a design layout for manufacturing the semiconductor device, generating a first layout by performing machine learning-based process proximity correction (PPC), generating a second layout by performing optical proximity correction (OPC), and outputting the second layout for a semiconductor process. The generating of the first layout includes generating a first after cleaning inspection (ACI) layout by executing a machine learning-based process proximity correction module on the design layout, generating a second after cleaning inspection layout by adjusting the design layout based on a difference of the first after cleaning inspection layout and the design layout and executing the process proximity correction module on the adjusted layout, and outputting the adjusted layout as the first layout, when a difference between the second after cleaning inspection layout and the design layout is smaller than or equal to a threshold value.
