17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Semiconductor Packages with Thermal Lid and Methods of Forming the Same
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Zhudong Township (TW)
Semiconductor Packages with Thermal Lid and Methods of Forming the Same - A simplified explanation of the abstract
This abstract first appeared for US patent application 17698611 titled 'Semiconductor Packages with Thermal Lid and Methods of Forming the Same
Simplified Explanation
The patent application is about semiconductor three-dimensional integrated circuit packages and the methods of forming them.
- The method involves bonding a semiconductor chip package to a substrate and depositing a thermal interface material on the semiconductor chip package.
- A thermal lid is placed over the semiconductor chip package and adhered to it using the thermal interface material.
- The thermal lid has a wedge feature that interfaces with the thermal interface material.
- The thermal lid is cured to adhere it to the semiconductor chip package.
Potential Applications
- This technology can be used in the manufacturing of semiconductor devices and integrated circuits.
- It can be applied in various electronic devices such as smartphones, computers, and other consumer electronics.
- It can also be used in industrial applications where high-performance and compact electronic systems are required.
Problems Solved
- This technology solves the problem of thermal management in semiconductor chip packages.
- By using a thermal interface material and a thermal lid, heat dissipation from the semiconductor chip package can be improved.
- It helps in preventing overheating and potential damage to the semiconductor chip.
Benefits
- Improved thermal management leads to better performance and reliability of semiconductor devices.
- The use of a thermal lid with a wedge feature enhances the adhesion between the lid and the semiconductor chip package.
- This technology allows for the integration of multiple chips in a compact package, enabling higher functionality in smaller devices.
Original Abstract Submitted
Semiconductor three-dimensional integrated circuit packages and methods of forming the same are disclosed herein. A method includes bonding a semiconductor chip package to a substrate and depositing a thermal interface material on the semiconductor chip package. A thermal lid may be placed over and adhered to the semiconductor chip package by the thermal interface material. The thermal lid includes a wedge feature interfacing the thermal interface material. The thermal lid may be adhered to the semiconductor chip package by curing the thermal interface material.
