17696989. THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP simplified abstract (Samsung Electronics Co., Ltd.)
THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP
Organization Name
Inventor(s)
Jongmin Lee of Hwaseong-si (KR)
THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP - A simplified explanation of the abstract
This abstract first appeared for US patent application 17696989 titled 'THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SEMICONDUCTOR CHIP
Simplified Explanation
The abstract describes a thermal pad for a semiconductor chip, the chip itself, and a method of manufacturing the chip. The thermal pad is designed to receive heat generated from a through silicon via (TSV) and dissipate it through a thermal head. The pad includes a thermal core in a trench on the lower surface of the semiconductor substrate, with insulation layers surrounding it.
- The thermal pad is located on the lower surface of a semiconductor chip.
- It includes a thermal core in a trench that receives heat from a through silicon via (TSV).
- A thermal head is connected to the thermal core and protrudes from the lower surface of the chip.
- The thermal head is responsible for dissipating the heat received by the thermal core.
- The thermal core is insulated by a first insulation layer between the trench's inner surface and the core.
- A second insulation layer is present between the first insulation layer and the thermal core.
Potential applications of this technology:
- Semiconductor chips in electronic devices that generate significant heat.
- High-performance computing systems that require efficient heat dissipation.
- Power electronics applications where thermal management is crucial.
Problems solved by this technology:
- Efficiently dissipating heat generated by a through silicon via (TSV).
- Preventing heat from damaging the semiconductor chip.
- Improving the overall thermal management of the chip.
Benefits of this technology:
- Enhanced thermal management capabilities for semiconductor chips.
- Improved reliability and longevity of electronic devices.
- Increased performance and efficiency of high-power applications.
Original Abstract Submitted
A thermal pad of a semiconductor chip, a semiconductor chip including the thermal pad, and a method of manufacturing the semiconductor chip, the thermal pad including a thermal core in a trench at a lower surface of a semiconductor substrate, the thermal core being configured to receive heat generated from a through silicon via (TSV) vertically extending through the semiconductor substrate; a thermal head connected to the thermal core and protruding from the lower surface of the semiconductor substrate, the thermal head being configured to dissipate the heat in the thermal core; a first insulation layer between an inner surface of the trench and the thermal core; and a second insulation layer between the first insulation layer and the thermal core.
