17692831. PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
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PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17692831 titled 'PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
Simplified Explanation
The abstract describes a printed circuit board (PCB) with specific features and pad patterns.
- The PCB has a substrate structure with a chip mounting region and a rectangular shape with four edges and corners.
- The second surface of the PCB has pad patterns, including a first region corresponding to the chip mounting region and second regions adjacent to the corners.
- The first region is in contact with the edges, and the second regions are spaced apart from each other by the first region.
- The pad patterns in the first region are surface-treated with a nickel/gold (Ni/Au) layer, while the pad patterns in the second regions are surface-treated with an organic solderability preservative.
Potential applications of this technology:
- Electronics manufacturing: The PCB design and pad patterns can be used in various electronic devices, such as smartphones, computers, and IoT devices.
- Semiconductor industry: The chip mounting region and pad patterns are essential for connecting the semiconductor chip to the PCB.
Problems solved by this technology:
- Improved connectivity: The specific pad patterns and surface treatments enhance the connectivity and reliability of the PCB.
- Protection against oxidation: The organic solderability preservative on the pad patterns in the second regions prevents oxidation and ensures proper soldering.
Benefits of this technology:
- Enhanced performance: The surface treatments and pad patterns improve the electrical performance and signal transmission of the PCB.
- Increased durability: The surface treatments protect the pad patterns from oxidation and corrosion, increasing the lifespan of the PCB.
Original Abstract Submitted
A printed circuit board includes: a substrate structure having a first surface including a chip mounting region on which a semiconductor chip is mounted and a second surface opposite to the first surface, the second surface having a rectangular shape having first to fourth edges and first to fourth corners formed by the first to fourth edges, and pad patterns on the second surface of the substrate structure, wherein the second surface includes a first region including a region corresponding to the chip mounting region and in contact with the first to fourth edges, respectively, and second regions adjacent to the first to fourth corners, respectively and spaced apart from each other by the first region, wherein the pad patterns include first pad patterns in the first region and surface-treated with a nickel/gold (Ni/Au) layer, and second pad patterns in the second regions and surface-treated with an organic solderability preservative.
