17691293. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO.,LTD.)

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SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO.,LTD.

Inventor(s)

Junmo Park of Seoul (KR)

Yeonho Park of Seoul (KR)

Kyubong Choi of Seoul (KR)

Eunsil Park of Hwaseong-si (KR)

Junseok Lee of Suwon-si (KR)

Jinseok Lee of Busan (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17691293 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a semiconductor device that includes a substrate with two active fins and a recess between them. It also includes a device isolation film, gate structures, and a field separation layer.

  • The substrate has two active fins extending in one direction, with a recess between them.
  • The device isolation film is placed on the substrate.
  • There are gate structures on each active fin, extending in another direction.
  • The field separation layer has two portions - one in the recess and one extending from both sides of the recess to the upper surface of the device isolation film.
  • The recess has a bottom surface lower than the upper surface of the device isolation film.
  • A region of the upper surface of the device isolation film is flat.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Electronic devices and components industry

Problems solved by this technology:

  • Improved device isolation and separation
  • Enhanced performance and efficiency of semiconductor devices

Benefits of this technology:

  • Better control and management of electrical signals
  • Increased functionality and reliability of semiconductor devices
  • Improved manufacturing processes and yield rates


Original Abstract Submitted

A semiconductor device includes a substrate including a first active fin and a second active fin respectively extending in a first direction, the substrate having a recess between the first and second active fins, a device isolation film on the substrate, first and second gate structures on the first and second active fins, respectively, and extending in a second direction, and a field separation layer having a first portion between the first and second active fin and in the recess, and a second portion extending from both sides of the first portion in the second direction to an upper surface of the device isolation film. The recess has a bottom surface lower in a third direction intersecting the first direction and the second direction than the upper surface of the device isolation film, and a region of the upper surface of the device isolation film has a flat surface.