17690376. TWO-DIMENSIONAL MATERIAL STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE TWO-DIMENSIONAL MATERIAL STRUCTURE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

TWO-DIMENSIONAL MATERIAL STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE TWO-DIMENSIONAL MATERIAL STRUCTURE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Minsu Seol of Seoul (KR)

Keunwook Shin of Yongin-si (KR)

Junyoung Kwon of Seoul (KR)

Minseok Yoo of Suwon-si (KR)

Changseok Lee of Gwacheon-si (KR)

TWO-DIMENSIONAL MATERIAL STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE TWO-DIMENSIONAL MATERIAL STRUCTURE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17690376 titled 'TWO-DIMENSIONAL MATERIAL STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE TWO-DIMENSIONAL MATERIAL STRUCTURE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Simplified Explanation

The patent application describes a two-dimensional material structure for a semiconductor device and a method of manufacturing it. The structure includes multiple layers of insulators and two-dimensional material films.

• The two-dimensional material structure consists of a first insulator made of a dielectric material, a second insulator made of a different dielectric material, and two two-dimensional material films.
• The first two-dimensional material film is on the surface of the first insulator, and the second two-dimensional material film is on the surface of the second insulator.
• Both two-dimensional material films have a layered structure, but the second film has more layers than the first film.

Potential applications of this technology:

• Semiconductor devices: The two-dimensional material structure can be used in various semiconductor devices, such as transistors, sensors, and optoelectronic devices.
• Flexible electronics: The use of two-dimensional materials allows for the fabrication of flexible and bendable electronic devices.
• Energy storage: The structure can be utilized in energy storage devices, such as batteries and supercapacitors.

Problems solved by this technology:

• Improved performance: The use of two-dimensional materials can enhance the performance of semiconductor devices, such as faster switching speeds and higher efficiency.
• Integration with existing technology: The method of manufacturing the two-dimensional material structure allows for compatibility with existing semiconductor fabrication processes.

Benefits of this technology:

• Miniaturization: The two-dimensional material structure enables the fabrication of smaller and more compact semiconductor devices.
• Flexibility: The structure's compatibility with flexible substrates enables the development of flexible and wearable electronics.
• Enhanced functionality: The unique properties of two-dimensional materials can enable new functionalities in semiconductor devices, such as improved sensing capabilities or higher energy storage capacity.

Original Abstract Submitted

Provided are a two-dimensional material structure, a semiconductor device including the two-dimensional material structure, and a method of manufacturing the semiconductor device. The two-dimensional material structure may include a first insulator including a first dielectric material; a second insulator on the first insulator and including a second dielectric material; a first two-dimensional material film on an exposed surface of the first insulator; and a second two-dimensional material film provided on an exposed surface of the second insulator. The first and second two-dimensional material films may include a two-dimensional material having a two-dimensional layered structure, and the second two-dimensional material film may include more layers of the two-dimensional material than the first two-dimensional material film.