17689558. IMAGE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
IMAGE SENSOR
Organization Name
Inventor(s)
IMAGE SENSOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 17689558 titled 'IMAGE SENSOR
Simplified Explanation
The patent application describes an image sensor with a unique structure and arrangement of components. Here are the key points:
- The image sensor consists of two chip structures, with pixels containing photoelectric conversion elements defined on the second chip structure.
- A light-transmissive cover is bonded to the edge region of the second chip structure using an adhesive layer.
- The cover has a recess portion that covers the region where the pixels are located.
- The second chip structure includes a substrate with color filters on one surface, a cover insulating layer covering the color filters, and microlenses on top of the cover insulating layer.
- The upper surface of the cover insulating layer is at a higher vertical level than the substrate's surface, creating a step difference of 3 μm to 15 μm.
Potential applications of this technology:
- Digital cameras and camcorders: The image sensor can be used to capture high-quality images and videos.
- Mobile devices: The compact size and improved image quality make it suitable for integration into smartphones and tablets.
- Surveillance systems: The image sensor's performance can enhance security cameras and monitoring systems.
Problems solved by this technology:
- Improved image quality: The arrangement of components and the step difference between the cover insulating layer and substrate help reduce interference and enhance image clarity.
- Compact design: The integration of multiple components into a single image sensor allows for smaller and more efficient devices.
- Enhanced durability: The bonding of the cover to the chip structure provides protection against external factors and increases the sensor's lifespan.
Benefits of this technology:
- Higher image resolution: The unique arrangement of components and the use of microlenses contribute to improved image sharpness and detail.
- Compact and lightweight: The design allows for smaller and thinner devices, making it easier to incorporate the image sensor into various applications.
- Enhanced durability: The bonding of the cover and the protective recess portion provide increased resistance to physical damage and environmental factors.
Original Abstract Submitted
An image sensor includes a first chip structure, a second chip structure disposed on the first chip structure, and in which pixels which each include a photoelectric conversion element are defined, and a light-transmissive cover bonded to an edge region of the second chip structure by an adhesive layer and having a recess portion covering a region in which the pixels are accommodated, wherein the second chip structure includes a substrate having a first surface and a second surface opposite to each other, color filters disposed on the second surface of the substrate to correspond to the pixels, a cover insulating layer covering the color filters, and accommodated in the recess portion and disposed to be horizontally spaced apart from an outer boundary of the recess portion, and microlenses disposed on the cover insulating layer to correspond to the pixels, respectively. An upper surface of the cover insulating layer is at a higher vertical level than the second surface of the substrate, and has a step difference of 3 μm to 15 μm with respect to the upper surface of the substrate.
