17684052. APPARATUS FOR INSPECTING SUBSTRATE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 APPARATUS FOR INSPECTING SUBSTRATE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 APPARATUS FOR INSPECTING SUBSTRATE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
APPARATUS FOR INSPECTING SUBSTRATE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Jang Ryul Park of Hwaseong-si (KR)
Kwang Rak Kim of Gunpo-si (KR)
Myung Jun Lee of Seongnam-si (KR)
Sung Ho Jang of Hwaseong-si (KR)
APPARATUS FOR INSPECTING SUBSTRATE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17684052 titled 'APPARATUS FOR INSPECTING SUBSTRATE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The patent application describes a method for fabricating a semiconductor device using an apparatus for inspecting the substrate. The method involves extracting a specific wavelength of light, acquiring position information of focal points on the substrate, adjusting the position of lenses or microspheres, condensing the light on the focal points, and inspecting the substrate using the condensed light.
- The method involves loading a substrate onto an inspection stage.
- A specific wavelength of light is extracted from a light source.
- Position information of focal points on the substrate is acquired based on the wavelength.
- The position of lenses or microspheres is adjusted vertically using the acquired position information.
- The extracted light is condensed on the focal points on the substrate.
- The substrate is inspected using the condensed light.
Potential Applications
- Fabrication of semiconductor devices
- Quality control and inspection of substrates
Problems Solved
- Accurate positioning and inspection of focal points on the substrate
- Efficient use of light for inspection purposes
Benefits
- Improved accuracy and precision in the fabrication process
- Enhanced quality control and inspection capabilities
- Increased efficiency and productivity in semiconductor manufacturing
Original Abstract Submitted
A method for fabricating a semiconductor device is provided. The method includes: loading a substrate on a stage of an apparatus for inspecting the substrate; extracting a first light having a first wavelength from a light by using a light source; acquiring first position information on at least one focal point, formed on the substrate, based on the first wavelength by using a controller, the at least one focal point being a pre-calculated at least one focal point; adjusting a position of at least one from among an objective lens and at least one microsphere in a vertical direction by using the first position information in the controller; condensing the first light, which has passed through the at least one microsphere, on the at least one focal point formed on the substrate; and inspecting the substrate by using the first light condensed on the at least one focal point.
