17680211. Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making simplified abstract (Microfabrica Inc.)
Contents
- 1 Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making
Organization Name
Inventor(s)
Uri Frodis of Los Angeles CA (US)
Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making - A simplified explanation of the abstract
This abstract first appeared for US patent application 17680211 titled 'Probes Having Improved Mechanical and/or Electrical Properties for Making Contact Between Electronic Circuit Elements and Methods for Making
Simplified Explanation
The patent application describes microscale and millimeter scale multi-layer structures, specifically probe structures for making contact between electronic components in semiconductor wafer and chip test applications. These structures consist of a core and shell on at least one layer, with the shell material being different from the core material in adjacent layers.
- Structures for making contact between electronic components
- Multi-layer design with core and shell materials
- Different core and shell materials in adjacent layers
Potential Applications
The technology could be applied in semiconductor testing, electronic component testing, and other industries requiring precise contact between components.
Problems Solved
The innovation solves the problem of achieving reliable and precise contact between electronic components in microscale and millimeter scale applications.
Benefits
The benefits of this technology include improved performance, reliability, and accuracy in electronic component testing and semiconductor applications.
Potential Commercial Applications
Potential commercial applications include semiconductor testing equipment, electronic component testing devices, and other industries requiring precise contact structures.
Possible Prior Art
Prior art in the field of microscale and millimeter scale multi-layer structures may include similar probe structures used in semiconductor testing and electronic component applications.
Unanswered Questions
How does the technology compare to existing probe structures in terms of performance and reliability?
The article does not provide a direct comparison between the new multi-layer structures and existing probe structures in terms of performance and reliability.
What are the specific industries or applications where this technology is expected to have the most significant impact?
The article does not specify the specific industries or applications where the technology is expected to have the most significant impact.
Original Abstract Submitted
Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g. probe structures for making contact between two electronic components for example in semiconductor wafer and chip and electronic component test applications). Some embodiments of the invention provide structures that include a core and shell on at least one layer where the layer including the shell is formed from at least one core material and at least one shell material wherein the shell material is different from a shell material or a single structural material on at least one of an immediately preceding layer or an immediately succeeding layer and wherein the core material is different from any core material on at least one of an immediately preceding layer or an immediately succeeding layer.
