17679587. CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Sanguk Han of Asan-si (KR)

Jaemin Jung of Seoul (KR)

Jeongkyu Ha of Hwaseong-si (KR)

Kwanjai Lee of Yongin-si (KR)

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17679587 titled 'CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

Simplified Explanation

The chip on film package described in this patent application includes a film substrate with a conductive pad and a conductive line pattern, a semiconductor chip, and a bump structure.

• The film substrate is made up of a base film, and it has a conductive pad that extends in a first direction and a conductive line pattern connected to the pad.
• The semiconductor chip is placed on the film substrate.
• A bump structure is positioned between the semiconductor chip and the conductive pad.
• The bump structure has two peripheral walls that extend in the first direction and create a trench.
• A portion of the conductive pad is located in the trench, and it is spaced apart from at least one of the peripheral walls.

Potential applications of this technology:

• This chip on film package can be used in various electronic devices that require compact and efficient packaging of semiconductor chips.
• It can be applied in mobile phones, tablets, laptops, and other portable electronic devices where space is limited.

Problems solved by this technology:

• The chip on film package provides a compact and efficient way to package semiconductor chips, saving space and reducing the overall size of electronic devices.
• The bump structure and conductive pad arrangement ensure proper electrical connections between the chip and the film substrate.

Benefits of this technology:

• The compact design of the chip on film package allows for smaller and thinner electronic devices.
• The efficient packaging of semiconductor chips improves the overall performance and reliability of electronic devices.
• The bump structure and conductive pad arrangement provide reliable electrical connections, reducing the risk of signal loss or failure.

Original Abstract Submitted

A chip on film package is provided. The chip on film package includes a film substrate with a base film, a conductive pad extending in a first direction on the base film, and a conductive line pattern extending from the conductive pad; a semiconductor chip provided on the film substrate; and a bump structure provided between the semiconductor chip and the conductive pad. A first peripheral wall and a second peripheral wall of the bump structure extend in the first direction and define a trench, a portion of the conductive pad is provided in the trench, and the conductive pad is spaced apart from at least one of the first peripheral wall and the second peripheral wall.