17677702. SEMICONDUCTOR DIE DIPPING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

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SEMICONDUCTOR DIE DIPPING STRUCTURE

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chi-Chun Peng of Hsinchu City (TW)

Chih-Yuan Chiu of Zhudong Township (TW)

Min-Yu Wu of Hsinchu City (TW)

Yi-Kai Tu of Hsinchu City (TW)

Cheng-Lung Wu of Zhunan Township (TW)

SEMICONDUCTOR DIE DIPPING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17677702 titled 'SEMICONDUCTOR DIE DIPPING STRUCTURE

Simplified Explanation

The abstract describes a die dipping structure that includes a plate with two recessed portions filled with different flux materials. The plate can be moved by a motor to simultaneously dip two dies into the respective flux materials.

  • The die dipping structure includes a plate with two recessed portions filled with different flux materials.
  • The first recessed portion has a different depth than the second recessed portion.
  • A motor is used to move the plate and dip two dies simultaneously into the flux materials.
  • The innovation allows for the simultaneous dipping of multiple dies into different flux materials.

Potential Applications

  • Semiconductor manufacturing
  • Electronics assembly
  • Integrated circuit testing

Problems Solved

  • Efficient and simultaneous dipping of multiple dies into different flux materials
  • Improved manufacturing process for semiconductor and electronic components

Benefits

  • Time-saving and efficient process
  • Enhanced productivity in die dipping operations
  • Improved quality control and testing capabilities


Original Abstract Submitted

A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.

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