17676866. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

From WikiPatents
Jump to navigation Jump to search

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chien-Yuan Huang of Hsinchu (TW)

Shih-Chang Ku of Taipei City (TW)

Chuei-Tang Wang of Taichung City (TW)

Chen-Hua Yu of Hsinchu City (TW)

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17676866 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Simplified Explanation

The abstract describes an integrated circuit package that includes two dies bonded together. The first die has pads and bonding pads, with a conductive via and a thermal via connecting them. The second die has bonding pads that are connected to the bonding pads of the first die.

  • The integrated circuit package includes two dies bonded together.
  • The first die has pads and bonding pads.
  • A conductive via connects one of the pads to one of the bonding pads.
  • A thermal via connects another pad to another bonding pad, while being electrically insulated.
  • The second die has bonding pads that are connected to the bonding pads of the first die.

Potential Applications

  • Integrated circuit packaging
  • Electronic devices

Problems Solved

  • Efficient electrical and thermal connections between dies
  • Integration of multiple dies in a single package

Benefits

  • Improved performance and reliability of integrated circuits
  • Compact and space-saving design
  • Enhanced thermal management


Original Abstract Submitted

An integrated circuit package includes first and second dies bonded to each other. The first die includes first die pads over a first device, first bonding pads over the first die pads, a first conductive via disposed between and electrically connected to a first one of the first die pads and a first one of the first bonding pads, and a first thermal via disposed between a second one of the first die pads and a second one of the first bonding pads and electrically insulated from the second one of the first die pads or the second one of the first bonding pads. The second die includes second bonding pads. The first one of the first bonding pads is connected to a first one of the second bonding pads. The second one of the first bonding pads is connected to a second one of the second bonding pads.

Retrieved from "http://wikipatents.org/index.php?title=17676866._INTEGRATED_CIRCUIT_PACKAGES_AND_METHODS_OF_FORMING_THE_SAME_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=19511"