17668622. SUBSTRATE INSPECTION METHOD AND DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SUBSTRATE INSPECTION METHOD AND DEVICE
Organization Name
Inventor(s)
Ilsuk Park of Hwaseong-si (KR)
SUBSTRATE INSPECTION METHOD AND DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17668622 titled 'SUBSTRATE INSPECTION METHOD AND DEVICE
Simplified Explanation
The patent application describes a method for inspecting a substrate for defects using different optical conditions. The method involves acquiring multiple images of the substrate under different optical conditions, and then calculating the differences between these images and a reference image.
- The method involves acquiring multiple defect of interest (DOI) images of a substrate under different optical conditions.
- The differences between these DOI images and a reference image are calculated to obtain DOI difference images.
- Further differences between the DOI difference images are calculated to obtain DOI difference-of-difference (DOD) images.
- The optical conditions corresponding to the DOD image with the highest signal-to-noise ratio (SNR) are selected as the first and second optical conditions.
- Images of the substrate are acquired under these selected optical conditions.
- The differences between these images and the reference image are calculated to obtain first and second difference images.
- A DOD image is then calculated by taking the difference between the first and second difference images.
- Finally, a low-SNR defect candidate region is detected by analyzing the first difference image, the second difference image, and the DOD image.
Potential applications of this technology:
- Quality control in manufacturing processes
- Inspection of electronic components and circuit boards
- Detection of defects in optical devices and lenses
- Surface inspection of materials and coatings
Problems solved by this technology:
- Efficient and accurate detection of defects in substrates
- Ability to detect low-SNR defect candidate regions
- Improved inspection capabilities under different optical conditions
Benefits of this technology:
- Enhanced quality control in manufacturing processes
- Increased productivity and efficiency in defect detection
- Improved accuracy and reliability in substrate inspection
Original Abstract Submitted
A substrate inspection method includes: (i) acquiring a plurality of defect of interest (DOI) images of a substrate having a DOI, under a corresponding plurality of different optical conditions, (ii) acquiring a plurality of DOI difference images from differences between the plurality of DOI images and a reference image, and (iii) acquiring a plurality of DOI difference-of-difference (DOD) images from differences between the plurality of DOI difference images. The method also includes setting two optical conditions corresponding to a DOI DOD image having the highest signal-to-noise ratio (SNR) among the plurality of DOI DOD images, as a first optical condition and a second optical condition, and acquiring a first image of the substrate under the first optical condition and a second image of the substrate under the second optical condition. A first difference image is also acquired, which is a difference between the first image and the reference image, and a second difference image is acquired, which is a difference between the second image and the reference image. A DOD image is acquired that is a difference between the first difference image and the second difference image. A low-SNR defect candidate region is then detected from the first difference image, the second difference image, and the DOD image.
