17643294. EMC MATERIAL FOR THERMAL TRANSPORT AND VIBRATION DAMPENING simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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EMC MATERIAL FOR THERMAL TRANSPORT AND VIBRATION DAMPENING

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Mehdi Hamid Vishkasougheh of Rochester MN (US)

Eric J. Campbell of Rochester MN (US)

Kevin O'connell of Rochester MN (US)

Arshad Alfoqaha of Eden Prairie MN (US)

EMC MATERIAL FOR THERMAL TRANSPORT AND VIBRATION DAMPENING - A simplified explanation of the abstract

This abstract first appeared for US patent application 17643294 titled 'EMC MATERIAL FOR THERMAL TRANSPORT AND VIBRATION DAMPENING

Simplified Explanation

The patent application relates to materials and methods for manufacturing enclosures for electronic devices. The materials include a tuned micro-lattice and a tuned composite metallic foam. The micro-lattice is made of metallic materials and is configured in a lattice pattern. The metallic materials extend over an elastomeric material. The composite metallic foam has different porosities in different portions. The materials can be used as gaskets or coatings for the interior of the enclosure.

  • The patent application describes materials and methods for manufacturing enclosures for electronic devices.
  • The materials include a tuned micro-lattice made of metallic materials in a lattice pattern.
  • The metallic materials extend over an elastomeric material.
  • The materials also include a tuned composite metallic foam with different porosities in different portions.
  • The materials can be used as gaskets or coatings for the interior of the enclosure.

Potential Applications

  • Manufacturing enclosures for electronic devices
  • Improving the performance and durability of enclosures
  • Enhancing the protection of electronic devices from external factors

Problems Solved

  • Providing materials that can effectively protect electronic devices housed in enclosures
  • Improving the durability and performance of enclosures
  • Enhancing the resistance of enclosures to external factors such as impact, moisture, and temperature changes

Benefits

  • Increased protection for electronic devices
  • Improved durability and performance of enclosures
  • Enhanced resistance to impact, moisture, and temperature changes


Original Abstract Submitted

Embodiments relate to materials and methods for manufacturing the materials for an enclosure that houses one or more electronic devices. In some embodiments, the materials include a tuned micro-lattice that includes one or more metallic materials defining a micro-lattice configuration. In some embodiments, the one or more metallic materials extend over at least a portion of an elastomeric material. In some embodiments, the materials include a tuned composite metallic foam including one or more metallic materials. A first portion of the foam has a first porosity and a second portion of the foam has a second porosity. In some embodiments, the materials for the enclosure are one or more of a gasket and a coating that extends over a least a portion of an interior portion of the enclosure.

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